Types of Lithography Machines
The lithography machine is an indispensable equipment in the semiconductor field. No matter what kind of chips are produced, it cannot be separated from the lithography machine. If the aero-engine represents the top level of the development of human science and technology, then the lithography machine is the semiconductor industry. The most dazzling pearl in the world, it has the characteristics of the highest technical difficulty, the highest cost per unit, and the determination of integration density.
Today, let’s take a look at the types of lithography machines. There are many types of lithography machines, which can be divided into several types according to their uses: there are lithography machines for producing chips; there are lithography machines for packaging; there are also lithography machines for LED manufacturing. Projection lithography machine in the field. The lithography machine used to produce chips is China’s biggest shortcoming in semiconductor equipment manufacturing.
Because optical lithography uses the projection method to draw the structure pattern of the large-scale integrated circuit device on the mask on the silicon wafer coated with photoresist, through the irradiation of light, the components of the photoresist undergo a chemical reaction, thereby Generate a circuit diagram. Limiting the minimum size attainable in a finished product is directly related to the resolution attainable by the lithography system, and reducing the wavelength of the illumination light source is the most effective way to improve resolution.
The earliest lithography machine used contact lithography, that is, the mask is attached to the silicon wafer for lithography, which is prone to pollution and has a short mask life. The subsequent proximity lithography machine has improved the contact lithography machine. A small gap is generated between the mask and the silicon wafer through the air cushion, and the mask and the silicon wafer are no longer in direct contact, but the imaging accuracy is not high due to the influence of the air cushion. .
According to the improvement of the light source used and the innovation and development of new lithography technologies such as dual worktables and immersion lithography, the lithography machine has experienced the development of 5 generations of products, and each improvement of the light source has significantly improved the lithography machine. process level, as well as production efficiency and yield.
The widely used lithography machines are divided into dry type and immersion type, and the most advanced lithography machine is called EUV lithography machine.
Under the law of Moore’s Law, and in today’s information age with the rapid development of science and technology, semiconductor industry personnel are full of worries about the future development of semiconductors. Therefore, we want to make a comprehensive improvement on the current chip manufacturing method through new lithography technology, and promote the semiconductor industry to enter a new development.
There are two main reasons for the continuous delay in the market schedule of EUV lithography machines. First, the required light source power cannot meet the working power requirement of 250 watts. Second, the optical lens and mirror system require optical precision. Extremely high and extremely difficult to produce. By 2020, mainstream mobile phone flagship chips will all use EUV technology.
Ultrasonic spray has the advantages of precise and controllable spray flow rate, thin and uniform coating, and controllable spray range. It is very suitable for spraying electronic products and is increasingly used for research and production. Ultrasonic spray technology can be used to deposit a uniform coating on substrates of any width. Ultrasonic Spray Electronics technology enables these very thin coatings to be produced with extremely high uniformity, resulting in very accurate and repeatable results to enhance product functionality.